General information

Type

CPU / Microprocessor

Market segment

Desktop

Family

Model number  ? 

B77

CPU part number

• HDXB77WFK3DGM is an OEM/tray microprocessor

Stepping code

AACAC AC

Frequency  ? 

3200 MHz

Bus speed  ? 

667 MHz Memory controller One 2000 MHz 16-bit HyperTransport link (4 GT/s)

Clock multiplier  ? 

16

Package

938-pin organic micro-PGA

Sockets

Socket AM2+ Socket AM3

Introduction date

2nd - 3rd quarter 2010

Architecture / Microarchitecture

Microarchitecture

K10

Platform

Dragon

Processor core  ? 

Heka

Core stepping  ? 

RB-C3

CPUID

100F43

Manufacturing process

0.045 micron silicon-on-insulator (SOI) technology

Die

258mm2

Data width

64 bit

The number of CPU cores

3

The number of threads

3

Floating Point Unit

Integrated

Level 1 cache size  ? 

3 x 64 KB 2-way set associative instruction caches 3 x 64 KB 2-way set associative data caches

Level 2 cache size  ? 

3 x 512 KB 16-way set associative exclusive caches

Level 3 cache size

Shared 6 MB 48-way set associative cache

Cache latency

3 (L1 cache)

Multiprocessing

Uniprocessor

Features

• MMX instructions

• Extensions to MMX

• 3DNow! technology

• Extensions to 3DNow!

• SSE / Streaming SIMD Extensions

• SSE2 / Streaming SIMD Extensions 2

• SSE3 / Streaming SIMD Extensions 3

• SSE4a  ? 

• AMD64 / AMD 64-bit technology  ? 

• EVP / Enhanced Virus Protection  ? 

• AMD-V / AMD Virtualization technology

Low power features

• Cool'n'Quiet 3.0

• CoolCore Technology  ? 

• Dual Dynamic Power Management  ? 

• Core C1 and C1E states

• Package S0, S1, S3, S4 and S5 states

Integrated peripherals / components

Integrated graphics

None

Memory controller

The number of controllers: 1 Memory channels: 2 Channel width (bits): 72 Supported memory: DDR2-1066, DDR3-1333 DIMMs per channel: up to 2 Maximum memory bandwidth (GB/s): 21.3

Other peripherals

HyperTransport 3 technology

Electrical / Thermal parameters

Thermal Design Power  ? 

95 Watt