Description

Heatsink not included

Product name: Composite uniform heat plate

Product size: 60*106*28mm

Product category: ordinary models (with semiconductor cooling back clip use, back material conductive silicon paper)

Magnetic (universal magnetic models and back clip models heat sink use, the back of the material double-sided adhesive)

How to use: Attach to the back of the phone, with the use of heat sink, increase the heat dissipation area, to achieve the phone CPU and camera cooling.

The magnetic absorbing product is embedded inside the magnetic sheet, seamlessly pasted, the magnetic absorbing radiator can be directly adsorbed to use.

[Mobile phone composite even heat plate] fast cooling uniform heat dissipation, increase the heat dissipation area, accelerate the speed of heat dissipation.

[Semiconductor cooling & large area heat sink] for cell phone hot spots, using a large area even heat sink, rapid neutralization of heat to achieve uniform heat dissipation effect.

[Strong adhesive - not fall off] strong adhesive, firmly adsorbed, no need to worry about radiator fall.

[Thin and light experience] The thickness is only 1mm, closely fit the phone.

[With silicone protection, do not hurt the phone] easy to take and easy to paste, with silicone protection, soft and do not hurt the machine.

1×Heat sink area increase plate